Browsing by Author "Boyuk, U."
Now showing items 1-19 of 19
-
Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders
Cadirli, E.; Boyuk, U.; Kaya, H.; Marasli, N.; Aksoz, S.; Ocak, Y. (SPRINGER, 2011)Pb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 ... -
Dependency of Microstructural Parameters and Microindentation Hardness on the Temperature Gradient in the In-Bi-Sn Ternary Alloy with a Low Melting Point
Kaya, H.; Boyuk, U.; Cadirli, E.; Ocak, Y.; Akbulut, S.; Keslioglu, K.; Marasli, N. (KOREAN INST METALS MATERIALS, 2008)The ternary alloy In-21.5 at.% Bi-17.8 at.% Sn, which has a melting point of 60 degrees C, was directionally solidified upward with a constant growth rate (V = 3.2 mu m/s) and different temperature gradients (G = 0.91 K/mm ... -
Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al-Cu alloys
Aksoz, S.; Ocak, Y.; Marasli, N.; Cadirli, E.; Kaya, H.; Boyuk, U. (ELSEVIER SCIENCE INC, 2010)The variations of thermal conductivity with temperature for Al-[x] wt.% Cu, x = 3, 6, 15 and 24 alloys were measured by using a radial heat flow apparatus. The variations of electrical conductivity of solid phases versus ... -
Directional solidification of Al-Cu-Ag alloy
Boyuk, U.; Marasli, N.; Kaya, H.; Cadirli, E.; Keslioglu, K. (SPRINGER HEIDELBERG, 2009)Al-Cu-Ag alloy was prepared in a graphite crucible under a vacuum atmosphere. The samples were directionally solidified upwards under an argon atmosphere with different temperature gradients (G=3.99-8.79 K/mm), at a constant ... -
The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point
Cadirli, E.; Boyuk, U.; Kaya, H.; Marasli, N.; Keslioglu, K.; Akbulut, S.; Ocak, Y. (ELSEVIER SCIENCE SA, 2009)In-21.5 at.% Bi-17.8 at.% Sn ternary alloy which has 333 K melting point was directionally solidified upward with a constant temperature gradient (G = 0.91 K/mm) in a wide range of growth rates (3.2-157.1 mu m/s) with a ... -
Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder
Cadirli, E.; Boyuk, U.; Kaya, H.; Marasli, N. (KOREAN INST METALS MATERIALS, 2012)Sn-Bi-Zn lead free solder alloy was directionally solidified upward at a constant temperature gradient (G=3.99 K/mm) with a wide range of growth rates (8.3-478.6 mu m/s) and at a constant growth rate (V=8.3 mu m/s) with a ... -
Experimental investigation of the effect of solidification processing parameters on the rod spacings in the Sn-1.2 wt.% Cu alloy
Cadirli, E.; Boyuk, U.; Engin, S.; Kaya, H.; Marasli, N.; Ulgen, A. (ELSEVIER SCIENCE SA, 2009)Sn-1.2 wt.% Cu alloy was prepared in a graphite crucible under the vacuum atmosphere. The samples were directionally solidified upwards under argon atmosphere with different temperature gradients (G = 2.69-8.88 K/mm) at a ... -
Influence of growth rate on microstructure, microhardness, and electrical resistivity of directionally solidified Al-7 wt% Ni hypo-eutectic alloy
Kaya, H.; Boyuk, U.; Cadirli, E.; Marasli, N. (KOREAN INST METALS MATERIALS, 2013)Al-7 wt% Ni alloy was directionally solidified upwards with different growth rates, V (8.3-489.5 mu m/s) at constant temperature gradient, G (4.2 K/mm) using a Bridgman-type growth apparatus. The dependence of the dendritic ... -
Investigation of directional solidified Al-Ti alloy
Kaya, H.; Cadirli, E.; Boyuk, U.; Marasli, N. (ELSEVIER SCIENCE BV, 2009)Al-1 wt% Ti alloy was directionally solidified upwards under argon atmosphere under the two conditions; with different temperature gradients (G = 2.20-5.82 K/mm) at a constant growth rate (V = 8.30 mu m/s) and with different ... -
Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy
Cadirli, E.; Boyuk, U.; Engin, S.; Kaya, H.; Marasli, N.; Ari, M. (SPRINGER, 2010)Sn-3 wt% Cu hypereutectic alloy was directionally solidified upward with different growth rates (2.24-133.33 mu m/s) at a constant temperature gradient (4.24 K/mm) and with different temperature gradients (4.24-8.09 K/mm) ... -
Investigation of the effect of solidification processing parameters on microhardness and determination of thermo-physical properties in the Zn-Cu peritectic alloy
Boyuk, U.; Kaya, H.; Cadirli, E.; Marasli, N.; Ulgen, A. (ELSEVIER SCIENCE SA, 2010)Zn-1.5wt.% Cu peritectic alloy was directionally solidified upward with different growth rates (8.41-661.11 mu m/s) at a constant temperature gradient (7.81 K/mm) and with different temperature gradients (1.99-7.81 K/mm) ... -
Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn-Cu hypereutectic alloy
Cadirli, E.; Boyuk, U.; Engin, S.; Kaya, H.; Marasli, N.; Keslioglu, K.; Ulgen, A. (SPRINGER, 2010)Sn-3 wt% Cu hypereutectic alloy was prepared in a graphite crucible under the vacuum atmosphere. The samples were directionally solidified upwards under argon atmosphere with different temperature gradients (G = 4.24-8.09 ... -
Measurements of Microhardness and Thermal and Electrical Properties of the Binary Zn-0.7wt.%Cu Hypoperitectic Alloy
Kaya, H.; Boyuk, U.; Engin, S.; Cadirli, E.; Marasli, N. (SPRINGER, 2010)Zn-0.7wt.%Cu hypoperitectic alloys were directionally solidified upwards with different temperature gradients (3.85 K/mm to 9.95 K/mm) at a constant growth rate (0.042 mm/s), and with different growth rates (0.0083 mm/s ... -
Measurements of the microhardness, electrical and thermal properties of the Al-Ni eutectic alloy
Kaya, H.; Boyuk, U.; Cadirli, E.; Marasli, N. (ELSEVIER SCI LTD, 2012)Al-5.7 wt% Ni eutectic alloy was directionally solidified upward with different temperature gradients (0.83-4.02 K/mm) at a constant growth rate (0.008 mm/s) and with different growth rates (0.008-0.483 mm/s) at a constant ... -
A study of microstructure and solidification behaviour of Zn-Cu alloy
Boyuk, U.; Engin, S.; Kaya, H.; Cadirli, E.; Marasli, N.; Keslioglu, K. (REDAKCIA KOVOVE MATERIALY, 2010)Zn-1.5wt.%Cu peritectic alloy was prepared in a graphite crucible under a vacuum atmosphere. Unidirectional solidification of Zn-1.5wt.%Cu peritectic alloy was carried out with the Bridgman method by using metals of 99.99 ... -
Unidirectional solidification of aluminium-nickel eutectic alloy
Kaya, H.; Boyuk, U.; Cadirli, E.; Marasli, N. (REDAKCIA KOVOVE MATERIALY, 2010)Aluminium nickel of (99 99 %) high purity eutectic alloy was melted in a graphite crucible under vacuum atmosphere The eutectic alloy was directionally solidified upward with a constant growth rate V (8 32 mu m s(-1)) and ... -
Variation of microindentation hardness with solidification and microstructure parameters in the Al based alloys
Kaya, H.; Cadirli, E.; Boyuk, U.; Marasli, N. (ELSEVIER SCIENCE BV, 2008)The Al based alloys (Al-3 wt%Si, Al-3 wt%Cu and Al-1 wt%Ti) were prepared using metals of 99.99% high purity in the vacuum atmosphere. These alloys were directionally solidified upward with a constant growth rate (V = 0.008 ... -
Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al-Cu-Ag eutectic alloy
Boyuk, U.; Marasli, N.; Cadirli, E.; Kaya, H.; Keslioglu, K. (ELSEVIER SCIENCE BV, 2012)Al-Cu-Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83-498.25 mu m/s) at a constant temperature gradient (8.79 K/mm) and with different temperature gradients (3.99-8.79 K/mm) at a ... -
Variations of microhardness with the solidification processing parameters and thermo-electrical properties with the temperature in the Sn-Cu alloy
Cadirli, E.; Boyuk, U.; Engin, S.; Kaya, H.; Marasli, N. (REDAKCIA KOVOVE MATERIALY, 2009)Sn-1.2wt.%Cu eutectic alloy was directionally solidified upward with different growth rates (2-78-136.36 mu m s(-1)) at a constant temperature gradient (2.69 K mm(-1)) and with different temperature gradients (2.69-8.88 K ...
