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Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

Access

info:eu-repo/semantics/closedAccess

Date

2011

Author

Cadirli, E.
Boyuk, U.
Kaya, H.
Marasli, N.
Aksoz, S.
Ocak, Y.

Metadata

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Abstract

Pb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity (rho) with temperature in the range of 323 K to 423 K for the directionally solidified Pb-Sn solders were measured. The present measurements indicate that the electrical resistivity of the directionally solidified Pb-Sn solders increases with increasing temperature, whereas the resistivity of the Pb-Sn solders decreases with increasing Sn content. The dependency of the Lorenz number (L) on temperature and Sn content for the Pb-Sn solders was also investigated based on the Wiedemann-Franz law by using the measured values of the thermal (K) and electrical (sigma) conductivity for the same alloys.

Source

JOURNAL OF ELECTRONIC MATERIALS

Volume

40

Issue

2

URI

https://dx.doi.org/10.1007/s11664-010-1425-8
https://hdl.handle.net/11480/4753

Collections

  • Makale Koleksiyonu [2055]
  • Öksüz Yayınlar Koleksiyonu - Scopus [2338]
  • Öksüz Yayınlar Koleksiyonu - WoS [2361]



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