Now showing items 1-5 of 5
Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy
(ELSEVIER SCIENCE BV, 2010)
The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary ...
Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al-Cu alloys
(ELSEVIER SCIENCE INC, 2010)
The variations of thermal conductivity with temperature for Al-[x] wt.% Cu, x = 3, 6, 15 and 24 alloys were measured by using a radial heat flow apparatus. The variations of electrical conductivity of solid phases versus ...
Interfacial energies of solid CuAl2 in the CuAl2-Ag2Al pseudo binary alloy
(ELSEVIER SCIENCE SA, 2010)
Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy are important parameters for people doing comparisons between experimentally observed solidification morphology and predictions from ...
Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders
Pb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 ...
Determination of Interfacial Energies for Solid Al Solution in Equilibrium with Al-Cu-Ag Liquid
(KOREAN INST METALS MATERIALS, 2010)
The equilibrated grain boundary groove shapes of a solid Al solution in equilibrium with Al-Cu-Ag liquid were observed from a quenched sample using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid ...