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Influence of growth rate on microstructure, microhardness, and electrical resistivity of directionally solidified Al-7 wt% Ni hypo-eutectic alloy

Kaya, H.; Boyuk, U.; Cadirli, E.; Marasli, N. (KOREAN INST METALS MATERIALS, 2013)

Al-7 wt% Ni alloy was directionally solidified upwards with different growth rates, V (8.3-489.5 mu m/s) at constant temperature gradient, G (4.2 K/mm) using a Bridgman-type growth apparatus. The dependence of the dendritic ...

Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders

Cadirli, E.; Boyuk, U.; Kaya, H.; Marasli, N.; Aksoz, S.; Ocak, Y. (SPRINGER, 2011)

Pb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 ...