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The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys
(SPRINGER, 2011)
Tin-copper of (99.99%) high purity alloys were directionally solidified upward with different compositions, C (o) , Sn-(1.2, 3, 6 and 15)wt% Cu under two different solidification conditions (temperature gradient (G) = 8 ...
Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn-Cu hypereutectic alloy
(SPRINGER, 2010)
Sn-3 wt% Cu hypereutectic alloy was prepared in a graphite crucible under the vacuum atmosphere. The samples were directionally solidified upwards under argon atmosphere with different temperature gradients (G = 4.24-8.09 ...
Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder
(KOREAN INST METALS MATERIALS, 2012)
Sn-Bi-Zn lead free solder alloy was directionally solidified upward at a constant temperature gradient (G=3.99 K/mm) with a wide range of growth rates (8.3-478.6 mu m/s) and at a constant growth rate (V=8.3 mu m/s) with a ...
Measurements of the microhardness, electrical and thermal properties of the Al-Ni eutectic alloy
(ELSEVIER SCI LTD, 2012)
Al-5.7 wt% Ni eutectic alloy was directionally solidified upward with different temperature gradients (0.83-4.02 K/mm) at a constant growth rate (0.008 mm/s) and with different growth rates (0.008-0.483 mm/s) at a constant ...
Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy
(SPRINGER, 2010)
Sn-3 wt% Cu hypereutectic alloy was directionally solidified upward with different growth rates (2.24-133.33 mu m/s) at a constant temperature gradient (4.24 K/mm) and with different temperature gradients (4.24-8.09 K/mm) ...
Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al-Cu-Ag eutectic alloy
(ELSEVIER SCIENCE BV, 2012)
Al-Cu-Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83-498.25 mu m/s) at a constant temperature gradient (8.79 K/mm) and with different temperature gradients (3.99-8.79 K/mm) at a ...
Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy
(ELSEVIER SCIENCE BV, 2010)
The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary ...
Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al-Cu alloys
(ELSEVIER SCIENCE INC, 2010)
The variations of thermal conductivity with temperature for Al-[x] wt.% Cu, x = 3, 6, 15 and 24 alloys were measured by using a radial heat flow apparatus. The variations of electrical conductivity of solid phases versus ...
Unidirectional solidification of aluminium-nickel eutectic alloy
(REDAKCIA KOVOVE MATERIALY, 2010)
Aluminium nickel of (99 99 %) high purity eutectic alloy was melted in a graphite crucible under vacuum atmosphere The eutectic alloy was directionally solidified upward with a constant growth rate V (8 32 mu m s(-1)) and ...
A study of microstructure and solidification behaviour of Zn-Cu alloy
(REDAKCIA KOVOVE MATERIALY, 2010)
Zn-1.5wt.%Cu peritectic alloy was prepared in a graphite crucible under a vacuum atmosphere. Unidirectional solidification of Zn-1.5wt.%Cu peritectic alloy was carried out with the Bridgman method by using metals of 99.99 ...