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Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder
(KOREAN INST METALS MATERIALS, 2012)
Sn-Bi-Zn lead free solder alloy was directionally solidified upward at a constant temperature gradient (G=3.99 K/mm) with a wide range of growth rates (8.3-478.6 mu m/s) and at a constant growth rate (V=8.3 mu m/s) with a ...
Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder
(SPRINGER, 2012)
The Sn-3.5 wt% Ag eutectic alloy was directionally solidified upward with a constant growth rate (V = 16.5 mu m/s) at different temperature gradients (G = 1.43-4.28 K/mm) and with a constant temperature gradient (G = 3.93 ...
Directional cellular growth of Al-2 wt% Li bulk samples
(SPRINGER, 2009)
Al-2 wt% Li alloy was prepared using metals of 99.99% high purity in the vacuum atmosphere. The bulk samples were directionally solidified upward with a constant growth rate, V, (similar to 8.30 mu m/s) and different ...
Dependency of microindentation hardness on solidification processing parameters and cellular spacing in the directionally solidified Al based alloys
(ELSEVIER SCIENCE SA, 2009)
Al based alloys (Al-0.1 wt.%Ti, Al-05 wt.%Ti and Al-2 wt.%Li) were prepared using metals of 99.99% high purity in the vacuum atmosphere. These alloys were directionally solidified upward with the different temperature ...
Measurements of the microhardness, electrical and thermal properties of the Al-Ni eutectic alloy
(ELSEVIER SCI LTD, 2012)
Al-5.7 wt% Ni eutectic alloy was directionally solidified upward with different temperature gradients (0.83-4.02 K/mm) at a constant growth rate (0.008 mm/s) and with different growth rates (0.008-0.483 mm/s) at a constant ...
The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point
(ELSEVIER SCIENCE SA, 2009)
In-21.5 at.% Bi-17.8 at.% Sn ternary alloy which has 333 K melting point was directionally solidified upward with a constant temperature gradient (G = 0.91 K/mm) in a wide range of growth rates (3.2-157.1 mu m/s) with a ...
Effects of growth rate and temperature gradient on the microstructure parameters in the directionally solidified succinonitrile-7.5 wt.% carbon tetrabromide alloy
(ELSEVIER SCIENCE SA, 2008)
Succinonitrile (SCN)-7.5 wt.% carbon tetrabromide (CTB) alloy was unidirectionally solidified with a constant growth rate (V = 33 mu m/s) at five different temperature gradients (G = 4.1-7.6 K/mm) and with a constant ...
Determination of solid-liquid interfacial energies in the In-Bi-Sn ternary alloy
(IOP PUBLISHING LTD, 2008)
The equilibrated grain boundary groove shapes of solid In(2)Bi solution in equilibrium with the In-Bi-Sn eutectic liquid were observed from a quenched sample at 59 degrees C. The Gibbs-Thomson coefficient, solid-liquid ...
INFLUENCE OF GROWTH RATE ON MICROSTRUCTURE AND MICROINDENTATION HARDNESS OF DIRECTIONALLY SOLIDIFIED TIN-CADMIUM EUTECTIC ALLOY
(WORLD SCIENTIFIC PUBL CO PTE LTD, 2009)
Sn-Cd eutectic melt was first obtained in a hot filling furnace and then directionally solidified upward with different growth rate ranges (8.1-165 mu m/s) at a constant temperature gradient G (4.35 K/mm) in the Bridgman-type ...
Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy
(SPRINGER, 2010)
Sn-3 wt% Cu hypereutectic alloy was directionally solidified upward with different growth rates (2.24-133.33 mu m/s) at a constant temperature gradient (4.24 K/mm) and with different temperature gradients (4.24-8.09 K/mm) ...
