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The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys
Tin-copper of (99.99%) high purity alloys were directionally solidified upward with different compositions, C (o) , Sn-(1.2, 3, 6 and 15)wt% Cu under two different solidification conditions (temperature gradient (G) = 8 ...
Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy
Sn-3.5 wt% Ag alloy was directionally solidified upward with a constant growth rate (V = 16.5 mu m/s) and a temperature gradient (G = 3.3 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity ...