Search
Now showing items 1-5 of 5
The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys
(SPRINGER, 2011)
Tin-copper of (99.99%) high purity alloys were directionally solidified upward with different compositions, C (o) , Sn-(1.2, 3, 6 and 15)wt% Cu under two different solidification conditions (temperature gradient (G) = 8 ...
Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100-x-Sn-x Solders
(SPRINGER, 2011)
Pb100-x-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward over a wide range of cooling rates (T) over dot (0.016 K s(-1) to 4.0 K s(-1)) by ...
Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders
(SPRINGER, 2011)
Pb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 ...
Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy
(SPRINGER, 2011)
Sn-3.5 wt% Ag alloy was directionally solidified upward with a constant growth rate (V = 16.5 mu m/s) and a temperature gradient (G = 3.3 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity ...
Investigation of the effect of composition on microhardness and determination of thermo-physical properties in the Zn-Cu alloys
(ELSEVIER SCI LTD, 2011)
Zinc-copper of (99.99%) high purity alloys were directionally solidified upward with different compositions, C-o, Zn-(0.7,1.5, 2.4 and 7.37) wt.% Cu under two different solidification conditions (G = 3.85 K/mm, V = 0.0083 ...
