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Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100-x-Sn-x Solders
Pb100-x-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward over a wide range of cooling rates (T) over dot (0.016 K s(-1) to 4.0 K s(-1)) by ...
Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy
Sn-3.5 wt% Ag alloy was directionally solidified upward with a constant growth rate (V = 16.5 mu m/s) and a temperature gradient (G = 3.3 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity ...