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Determination of mechanical, electrical and thermal properties of the Sn-Bi-Zn ternary alloy
(ELSEVIER SCIENCE BV, 2011)
The development of lead-free solders has emerged as one of the key issues in the electronics packaging industries. Sn-Zn-Bi eutectic alloy has been considered as one of the lead-free solder materials that can replace the ...
Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al-Cu-Ag eutectic alloy
(ELSEVIER SCIENCE BV, 2012)
Al-Cu-Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83-498.25 mu m/s) at a constant temperature gradient (8.79 K/mm) and with different temperature gradients (3.99-8.79 K/mm) at a ...
Effect of rotating magnetic field on the microstructures and physical properties of Al-Cu-Co ternary eutectic alloy
(ELSEVIER SCIENCE SA, 2015)
The solidification microstructures and physical properties of Al-Cu-Co ternary eutectic alloy were studied in a rotating magnetic field (RMF). The RMF-driven flow was the key factor causing grain refinement and uniformity ...
