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The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point
(ELSEVIER SCIENCE SA, 2009)
In-21.5 at.% Bi-17.8 at.% Sn ternary alloy which has 333 K melting point was directionally solidified upward with a constant temperature gradient (G = 0.91 K/mm) in a wide range of growth rates (3.2-157.1 mu m/s) with a ...
Interfacial energies of solid CuAl2 in the CuAl2-Ag2Al pseudo binary alloy
(ELSEVIER SCIENCE SA, 2010)
Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy are important parameters for people doing comparisons between experimentally observed solidification morphology and predictions from ...