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Now showing items 11-20 of 31
The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point
(ELSEVIER SCIENCE SA, 2009)
In-21.5 at.% Bi-17.8 at.% Sn ternary alloy which has 333 K melting point was directionally solidified upward with a constant temperature gradient (G = 0.91 K/mm) in a wide range of growth rates (3.2-157.1 mu m/s) with a ...
Effects of growth rate and temperature gradient on the microstructure parameters in the directionally solidified succinonitrile-7.5 wt.% carbon tetrabromide alloy
(ELSEVIER SCIENCE SA, 2008)
Succinonitrile (SCN)-7.5 wt.% carbon tetrabromide (CTB) alloy was unidirectionally solidified with a constant growth rate (V = 33 mu m/s) at five different temperature gradients (G = 4.1-7.6 K/mm) and with a constant ...
Determination of solid-liquid interfacial energies in the In-Bi-Sn ternary alloy
(IOP PUBLISHING LTD, 2008)
The equilibrated grain boundary groove shapes of solid In(2)Bi solution in equilibrium with the In-Bi-Sn eutectic liquid were observed from a quenched sample at 59 degrees C. The Gibbs-Thomson coefficient, solid-liquid ...
Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy
(SPRINGER, 2010)
Sn-3 wt% Cu hypereutectic alloy was directionally solidified upward with different growth rates (2.24-133.33 mu m/s) at a constant temperature gradient (4.24 K/mm) and with different temperature gradients (4.24-8.09 K/mm) ...
Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al-Cu-Ag eutectic alloy
(ELSEVIER SCIENCE BV, 2012)
Al-Cu-Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83-498.25 mu m/s) at a constant temperature gradient (8.79 K/mm) and with different temperature gradients (3.99-8.79 K/mm) at a ...
Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy
(ELSEVIER SCIENCE BV, 2010)
The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary ...
Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al-Cu alloys
(ELSEVIER SCIENCE INC, 2010)
The variations of thermal conductivity with temperature for Al-[x] wt.% Cu, x = 3, 6, 15 and 24 alloys were measured by using a radial heat flow apparatus. The variations of electrical conductivity of solid phases versus ...
Unidirectional solidification of aluminium-nickel eutectic alloy
(REDAKCIA KOVOVE MATERIALY, 2010)
Aluminium nickel of (99 99 %) high purity eutectic alloy was melted in a graphite crucible under vacuum atmosphere The eutectic alloy was directionally solidified upward with a constant growth rate V (8 32 mu m s(-1)) and ...
A study of microstructure and solidification behaviour of Zn-Cu alloy
(REDAKCIA KOVOVE MATERIALY, 2010)
Zn-1.5wt.%Cu peritectic alloy was prepared in a graphite crucible under a vacuum atmosphere. Unidirectional solidification of Zn-1.5wt.%Cu peritectic alloy was carried out with the Bridgman method by using metals of 99.99 ...
Directional solidification of Al-Cu-Ag alloy
(SPRINGER HEIDELBERG, 2009)
Al-Cu-Ag alloy was prepared in a graphite crucible under a vacuum atmosphere. The samples were directionally solidified upwards under an argon atmosphere with different temperature gradients (G=3.99-8.79 K/mm), at a constant ...
