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Interfacial energies of solid CuAl2 in the CuAl2-Ag2Al pseudo binary alloy
(ELSEVIER SCIENCE SA, 2010)
Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy are important parameters for people doing comparisons between experimentally observed solidification morphology and predictions from ...
Influence of growth rate on microstructure, microhardness, and electrical resistivity of directionally solidified Al-7 wt% Ni hypo-eutectic alloy
(KOREAN INST METALS MATERIALS, 2013)
Al-7 wt% Ni alloy was directionally solidified upwards with different growth rates, V (8.3-489.5 mu m/s) at constant temperature gradient, G (4.2 K/mm) using a Bridgman-type growth apparatus. The dependence of the dendritic ...
Measurement of solid-liquid interfacial energy in the In-Bi eutectic alloy at low melting temperature
(IOP PUBLISHING LTD, 2007)
The Gibbs-Thomson coefficient and solid-liquid interfacial energy of the solid In solution in equilibrium with In Bi eutectic liquid have been determined to be (1.46 +/- 0.07) x 10(-7) K m and (40.4 +/- 4.0) x 10(-3) J ...
Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders
(SPRINGER, 2011)
Pb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 ...
The Dependence of Lamellar Spacings and Microhardness on the Growth Rate in the Directionally Solidified Bi-43 wt.% Sn Alloy at a Constant Temperature Gradient
(KOREAN INST METALS MATERIALS, 2009)
Bi-43 wt.% Sn eutectic samples were directionally solidified upward with five different growth rates (V = 8.3-164.8 mu m/s) at a constant temperature gradient (G = 3.55 K/mm) in a Bridgman type directional solidification ...
Determination of interfacial energies of solid Sn solution in the In-Bi-Sn ternary alloy
(ELSEVIER SCIENCE INC, 2009)
The equilibrated grain boundary groove shapes of solid Sn solution (Sn-40.14 at.% In-16.11 at.% Bi) in equilibrium with the In-Bi-Sn liquid (In-21.23 at.% Bi-19.04 at.% Sn) were observed from the quenched sample at 59 ...
Measurements of Microhardness and Thermal and Electrical Properties of the Binary Zn-0.7wt.%Cu Hypoperitectic Alloy
(SPRINGER, 2010)
Zn-0.7wt.%Cu hypoperitectic alloys were directionally solidified upwards with different temperature gradients (3.85 K/mm to 9.95 K/mm) at a constant growth rate (0.042 mm/s), and with different growth rates (0.0083 mm/s ...
Determination of Interfacial Energies for Solid Al Solution in Equilibrium with Al-Cu-Ag Liquid
(KOREAN INST METALS MATERIALS, 2010)
The equilibrated grain boundary groove shapes of a solid Al solution in equilibrium with Al-Cu-Ag liquid were observed from a quenched sample using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid ...
Investigation of the effect of solidification processing parameters on microhardness and determination of thermo-physical properties in the Zn-Cu peritectic alloy
(ELSEVIER SCIENCE SA, 2010)
Zn-1.5wt.% Cu peritectic alloy was directionally solidified upward with different growth rates (8.41-661.11 mu m/s) at a constant temperature gradient (7.81 K/mm) and with different temperature gradients (1.99-7.81 K/mm) ...
Experimental investigation of the effect of solidification processing parameters on the rod spacings in the Sn-1.2 wt.% Cu alloy
(ELSEVIER SCIENCE SA, 2009)
Sn-1.2 wt.% Cu alloy was prepared in a graphite crucible under the vacuum atmosphere. The samples were directionally solidified upwards under argon atmosphere with different temperature gradients (G = 2.69-8.88 K/mm) at a ...
