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Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy
(SPRINGER, 2010)
Sn-3 wt% Cu hypereutectic alloy was directionally solidified upward with different growth rates (2.24-133.33 mu m/s) at a constant temperature gradient (4.24 K/mm) and with different temperature gradients (4.24-8.09 K/mm) ...