Now showing items 1-3 of 3
Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn-Cu hypereutectic alloy
Sn-3 wt% Cu hypereutectic alloy was prepared in a graphite crucible under the vacuum atmosphere. The samples were directionally solidified upwards under argon atmosphere with different temperature gradients (G = 4.24-8.09 ...
Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy
Sn-3 wt% Cu hypereutectic alloy was directionally solidified upward with different growth rates (2.24-133.33 mu m/s) at a constant temperature gradient (4.24 K/mm) and with different temperature gradients (4.24-8.09 K/mm) ...
Thermal conductivity and interfacial energies of solid Sn in the Sn-Cu alloy
(ELSEVIER SCIENCE BV, 2010)
The equilibrated grain boundary groove shapes of solid Sn in equilibrium with the Sn-Cu eutectic liquid were observed from a quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary ...