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Variations of microhardness with the solidification processing parameters and thermo-electrical properties with the temperature in the Sn-Cu alloy
(REDAKCIA KOVOVE MATERIALY, 2009)
Sn-1.2wt.%Cu eutectic alloy was directionally solidified upward with different growth rates (2-78-136.36 mu m s(-1)) at a constant temperature gradient (2.69 K mm(-1)) and with different temperature gradients (2.69-8.88 K ...
Variation of microindentation hardness with solidification and microstructure parameters in the Al based alloys
(ELSEVIER SCIENCE BV, 2008)
The Al based alloys (Al-3 wt%Si, Al-3 wt%Cu and Al-1 wt%Ti) were prepared using metals of 99.99% high purity in the vacuum atmosphere. These alloys were directionally solidified upward with a constant growth rate (V = 0.008 ...
Investigation of directional solidified Al-Ti alloy
(ELSEVIER SCIENCE BV, 2009)
Al-1 wt% Ti alloy was directionally solidified upwards under argon atmosphere under the two conditions; with different temperature gradients (G = 2.20-5.82 K/mm) at a constant growth rate (V = 8.30 mu m/s) and with different ...
Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn-Cu hypereutectic alloy
(SPRINGER, 2010)
Sn-3 wt% Cu hypereutectic alloy was prepared in a graphite crucible under the vacuum atmosphere. The samples were directionally solidified upwards under argon atmosphere with different temperature gradients (G = 4.24-8.09 ...
Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder
(KOREAN INST METALS MATERIALS, 2012)
Sn-Bi-Zn lead free solder alloy was directionally solidified upward at a constant temperature gradient (G=3.99 K/mm) with a wide range of growth rates (8.3-478.6 mu m/s) and at a constant growth rate (V=8.3 mu m/s) with a ...
Measurements of the microhardness, electrical and thermal properties of the Al-Ni eutectic alloy
(ELSEVIER SCI LTD, 2012)
Al-5.7 wt% Ni eutectic alloy was directionally solidified upward with different temperature gradients (0.83-4.02 K/mm) at a constant growth rate (0.008 mm/s) and with different growth rates (0.008-0.483 mm/s) at a constant ...
The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point
(ELSEVIER SCIENCE SA, 2009)
In-21.5 at.% Bi-17.8 at.% Sn ternary alloy which has 333 K melting point was directionally solidified upward with a constant temperature gradient (G = 0.91 K/mm) in a wide range of growth rates (3.2-157.1 mu m/s) with a ...
Investigation of microhardness and thermo-electrical properties in the Sn-Cu hypereutectic alloy
(SPRINGER, 2010)
Sn-3 wt% Cu hypereutectic alloy was directionally solidified upward with different growth rates (2.24-133.33 mu m/s) at a constant temperature gradient (4.24 K/mm) and with different temperature gradients (4.24-8.09 K/mm) ...
Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al-Cu-Ag eutectic alloy
(ELSEVIER SCIENCE BV, 2012)
Al-Cu-Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83-498.25 mu m/s) at a constant temperature gradient (8.79 K/mm) and with different temperature gradients (3.99-8.79 K/mm) at a ...
Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al-Cu alloys
(ELSEVIER SCIENCE INC, 2010)
The variations of thermal conductivity with temperature for Al-[x] wt.% Cu, x = 3, 6, 15 and 24 alloys were measured by using a radial heat flow apparatus. The variations of electrical conductivity of solid phases versus ...
