Search
Now showing items 1-10 of 10
Experimental determination of interfacial energies for Ag2Al solid solution in the CuAl2-Ag2Al system
(IOP PUBLISHING LTD, 2009)
The equilibrated grain boundary groove shapes of solid solution Ag2Al in equilibrium with an Al-Cu-Ag liquid were observed from a quenched sample with a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid ...
Variations of microhardness with the solidification processing parameters and thermo-electrical properties with the temperature in the Sn-Cu alloy
(REDAKCIA KOVOVE MATERIALY, 2009)
Sn-1.2wt.%Cu eutectic alloy was directionally solidified upward with different growth rates (2-78-136.36 mu m s(-1)) at a constant temperature gradient (2.69 K mm(-1)) and with different temperature gradients (2.69-8.88 K ...
Investigation of directional solidified Al-Ti alloy
(ELSEVIER SCIENCE BV, 2009)
Al-1 wt% Ti alloy was directionally solidified upwards under argon atmosphere under the two conditions; with different temperature gradients (G = 2.20-5.82 K/mm) at a constant growth rate (V = 8.30 mu m/s) and with different ...
Experimental determination of solid-solid and solid-liquid interfacial energies of solid epsilon (CuZn5) in the Zn-Cu alloy
(ELSEVIER SCIENCE SA, 2009)
The equilibrated grain boundary groove shapes of solid epsilon; (CuZn5) in equilibrium with Zn-1.75 at.% Cu peritectic liquid and solid epsilon (CuZn5) in equilibrium with solid Zn solution (Zn-2.83 at.% Cu) were observed ...
Dependency of microindentation hardness on solidification processing parameters and cellular spacing in the directionally solidified Al based alloys
(ELSEVIER SCIENCE SA, 2009)
Al based alloys (Al-0.1 wt.%Ti, Al-05 wt.%Ti and Al-2 wt.%Li) were prepared using metals of 99.99% high purity in the vacuum atmosphere. These alloys were directionally solidified upward with the different temperature ...
The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point
(ELSEVIER SCIENCE SA, 2009)
In-21.5 at.% Bi-17.8 at.% Sn ternary alloy which has 333 K melting point was directionally solidified upward with a constant temperature gradient (G = 0.91 K/mm) in a wide range of growth rates (3.2-157.1 mu m/s) with a ...
Directional solidification of Al-Cu-Ag alloy
(SPRINGER HEIDELBERG, 2009)
Al-Cu-Ag alloy was prepared in a graphite crucible under a vacuum atmosphere. The samples were directionally solidified upwards under an argon atmosphere with different temperature gradients (G=3.99-8.79 K/mm), at a constant ...
The Dependence of Lamellar Spacings and Microhardness on the Growth Rate in the Directionally Solidified Bi-43 wt.% Sn Alloy at a Constant Temperature Gradient
(KOREAN INST METALS MATERIALS, 2009)
Bi-43 wt.% Sn eutectic samples were directionally solidified upward with five different growth rates (V = 8.3-164.8 mu m/s) at a constant temperature gradient (G = 3.55 K/mm) in a Bridgman type directional solidification ...
Determination of interfacial energies of solid Sn solution in the In-Bi-Sn ternary alloy
(ELSEVIER SCIENCE INC, 2009)
The equilibrated grain boundary groove shapes of solid Sn solution (Sn-40.14 at.% In-16.11 at.% Bi) in equilibrium with the In-Bi-Sn liquid (In-21.23 at.% Bi-19.04 at.% Sn) were observed from the quenched sample at 59 ...
Experimental investigation of the effect of solidification processing parameters on the rod spacings in the Sn-1.2 wt.% Cu alloy
(ELSEVIER SCIENCE SA, 2009)
Sn-1.2 wt.% Cu alloy was prepared in a graphite crucible under the vacuum atmosphere. The samples were directionally solidified upwards under argon atmosphere with different temperature gradients (G = 2.69-8.88 K/mm) at a ...
