Now showing items 1-3 of 3
Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al-Cu-Ag eutectic alloy
(ELSEVIER SCIENCE BV, 2012)
Al-Cu-Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83-498.25 mu m/s) at a constant temperature gradient (8.79 K/mm) and with different temperature gradients (3.99-8.79 K/mm) at a ...
Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al-Cu alloys
(ELSEVIER SCIENCE INC, 2010)
The variations of thermal conductivity with temperature for Al-[x] wt.% Cu, x = 3, 6, 15 and 24 alloys were measured by using a radial heat flow apparatus. The variations of electrical conductivity of solid phases versus ...
Investigation of the effect of solidification processing parameters on microhardness and determination of thermo-physical properties in the Zn-Cu peritectic alloy
(ELSEVIER SCIENCE SA, 2010)
Zn-1.5wt.% Cu peritectic alloy was directionally solidified upward with different growth rates (8.41-661.11 mu m/s) at a constant temperature gradient (7.81 K/mm) and with different temperature gradients (1.99-7.81 K/mm) ...