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Interfacial energy of solid In2Bi intermetallic phase in equilibrium with In-Bi eutectic liquid at 72 degrees C equilibrating temperature 

Akbulut, S.; Ocak, Y.; Marasli, N.; Keslioglu, K.; Boeyuek, U.; Cadirli, E.; Kaya, H. (ELSEVIER SCIENCE INC, 2008)
A radial temperature gradient on the sample was established by heating from centre with a single heating wire and cooling the outside of sample at -10 degrees C with a heating/refrigerating circulating bath containing an ...

Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder 

Cadirli, E.; Boyuk, U.; Kaya, H.; Marasli, N. (KOREAN INST METALS MATERIALS, 2012)
Sn-Bi-Zn lead free solder alloy was directionally solidified upward at a constant temperature gradient (G=3.99 K/mm) with a wide range of growth rates (8.3-478.6 mu m/s) and at a constant growth rate (V=8.3 mu m/s) with a ...

Effects of growth rate and temperature gradient on the microstructure parameters in the directionally solidified succinonitrile-7.5 wt.% carbon tetrabromide alloy 

Marasli, N.; Keslioglu, K.; Arslan, B.; Kaya, H.; Cadirli, E. (ELSEVIER SCIENCE SA, 2008)
Succinonitrile (SCN)-7.5 wt.% carbon tetrabromide (CTB) alloy was unidirectionally solidified with a constant growth rate (V = 33 mu m/s) at five different temperature gradients (G = 4.1-7.6 K/mm) and with a constant ...

A study of microstructure and solidification behaviour of Zn-Cu alloy 

Boyuk, U.; Engin, S.; Kaya, H.; Cadirli, E.; Marasli, N.; Keslioglu, K. (REDAKCIA KOVOVE MATERIALY, 2010)
Zn-1.5wt.%Cu peritectic alloy was prepared in a graphite crucible under a vacuum atmosphere. Unidirectional solidification of Zn-1.5wt.%Cu peritectic alloy was carried out with the Bridgman method by using metals of 99.99 ...

Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders 

Cadirli, E.; Boyuk, U.; Kaya, H.; Marasli, N.; Aksoz, S.; Ocak, Y. (SPRINGER, 2011)
Pb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 ...

Determination of Interfacial Energies for Solid Al Solution in Equilibrium with Al-Cu-Ag Liquid 

Keslioglu, K.; Ocak, Y.; Aksoz, S.; Marasli, N.; Cadirli, E.; Kaya, H. (KOREAN INST METALS MATERIALS, 2010)
The equilibrated grain boundary groove shapes of a solid Al solution in equilibrium with Al-Cu-Ag liquid were observed from a quenched sample using a radial heat flow apparatus. The Gibbs-Thomson coefficient, solid-liquid ...



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AuthorCadirli, E. (6)Kaya, H. (6)
Marasli, N. (6)
Keslioglu, K. (4)Boyuk, U. (3)Ocak, Y. (3)Aksoz, S. (2)Akbulut, S. (1)Arslan, B. (1)Boeyuek, U. (1)... View MoreSubject
crystal growth (6)
thermal conductivity (3)alloys (2)solidification (2)cellular growth (1)electrical resistivity (1)grain boundary (1)grain boundary energy (1)In2Bi intermetallic phase (1)interfaces (1)... View MorePublication Type
article (6)
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eng (6)
Publication CategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı (6)Access Typeinfo:eu-repo/semantics/closedAccess (5)info:eu-repo/semantics/openAccess (1)Date Issued2008 (2)2010 (2)2011 (1)2012 (1)Full Text StatusWithout Full Text (6)

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