Search
Now showing items 1-10 of 26
Variation of microindentation hardness with solidification and microstructure parameters in the Al based alloys
(ELSEVIER SCIENCE BV, 2008)
The Al based alloys (Al-3 wt%Si, Al-3 wt%Cu and Al-1 wt%Ti) were prepared using metals of 99.99% high purity in the vacuum atmosphere. These alloys were directionally solidified upward with a constant growth rate (V = 0.008 ...
Investigation of directional solidified Al-Ti alloy
(ELSEVIER SCIENCE BV, 2009)
Al-1 wt% Ti alloy was directionally solidified upwards under argon atmosphere under the two conditions; with different temperature gradients (G = 2.20-5.82 K/mm) at a constant growth rate (V = 8.30 mu m/s) and with different ...
Investigation of the effect of solidification processing parameters on the rod spacings and variation of microhardness with the rod spacing in the Sn-Cu hypereutectic alloy
(SPRINGER, 2010)
Sn-3 wt% Cu hypereutectic alloy was prepared in a graphite crucible under the vacuum atmosphere. The samples were directionally solidified upwards under argon atmosphere with different temperature gradients (G = 4.24-8.09 ...
Experimental determination of solid-solid and solid-liquid interfacial energies of solid epsilon (CuZn5) in the Zn-Cu alloy
(ELSEVIER SCIENCE SA, 2009)
The equilibrated grain boundary groove shapes of solid epsilon; (CuZn5) in equilibrium with Zn-1.75 at.% Cu peritectic liquid and solid epsilon (CuZn5) in equilibrium with solid Zn solution (Zn-2.83 at.% Cu) were observed ...
Interfacial energy of solid In2Bi intermetallic phase in equilibrium with In-Bi eutectic liquid at 72 degrees C equilibrating temperature
(ELSEVIER SCIENCE INC, 2008)
A radial temperature gradient on the sample was established by heating from centre with a single heating wire and cooling the outside of sample at -10 degrees C with a heating/refrigerating circulating bath containing an ...
Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder
(KOREAN INST METALS MATERIALS, 2012)
Sn-Bi-Zn lead free solder alloy was directionally solidified upward at a constant temperature gradient (G=3.99 K/mm) with a wide range of growth rates (8.3-478.6 mu m/s) and at a constant growth rate (V=8.3 mu m/s) with a ...
Measurements of the microhardness, electrical and thermal properties of the Al-Ni eutectic alloy
(ELSEVIER SCI LTD, 2012)
Al-5.7 wt% Ni eutectic alloy was directionally solidified upward with different temperature gradients (0.83-4.02 K/mm) at a constant growth rate (0.008 mm/s) and with different growth rates (0.008-0.483 mm/s) at a constant ...
The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point
(ELSEVIER SCIENCE SA, 2009)
In-21.5 at.% Bi-17.8 at.% Sn ternary alloy which has 333 K melting point was directionally solidified upward with a constant temperature gradient (G = 0.91 K/mm) in a wide range of growth rates (3.2-157.1 mu m/s) with a ...
Effects of growth rate and temperature gradient on the microstructure parameters in the directionally solidified succinonitrile-7.5 wt.% carbon tetrabromide alloy
(ELSEVIER SCIENCE SA, 2008)
Succinonitrile (SCN)-7.5 wt.% carbon tetrabromide (CTB) alloy was unidirectionally solidified with a constant growth rate (V = 33 mu m/s) at five different temperature gradients (G = 4.1-7.6 K/mm) and with a constant ...
Determination of solid-liquid interfacial energies in the In-Bi-Sn ternary alloy
(IOP PUBLISHING LTD, 2008)
The equilibrated grain boundary groove shapes of solid In(2)Bi solution in equilibrium with the In-Bi-Sn eutectic liquid were observed from a quenched sample at 59 degrees C. The Gibbs-Thomson coefficient, solid-liquid ...
