Now showing items 1-4 of 4
Variations of microhardness with solidification parameters and electrical resistivity with temperature for Al-Cu-Ag eutectic alloy
(ELSEVIER SCIENCE BV, 2012)
Al-Cu-Ag eutectic alloy was directionally solidified upwards with different growth rates (1.83-498.25 mu m/s) at a constant temperature gradient (8.79 K/mm) and with different temperature gradients (3.99-8.79 K/mm) at a ...
Microstructural, mechanical, electrical and thermal characterization of arc-melted Ni-Si and Co-Si alloys
(ELSEVIER SCIENCE BV, 2010)
This work presents the results of characterization of as solidified arc-melted Ni-Si and Co-Si alloys. The alloys of different compositions of the constitutions Ni, Co, and Si of purity of 99.99% were prepared by arc melting ...
Measurements of the microhardness, electrical and thermal properties of the Al-Ni eutectic alloy
(ELSEVIER SCI LTD, 2012)
Al-5.7 wt% Ni eutectic alloy was directionally solidified upward with different temperature gradients (0.83-4.02 K/mm) at a constant growth rate (0.008 mm/s) and with different growth rates (0.008-0.483 mm/s) at a constant ...
Investigation of the effect of composition on microhardness and determination of thermo-physical properties in the Zn-Cu alloys
(ELSEVIER SCI LTD, 2011)
Zinc-copper of (99.99%) high purity alloys were directionally solidified upward with different compositions, C-o, Zn-(0.7,1.5, 2.4 and 7.37) wt.% Cu under two different solidification conditions (G = 3.85 K/mm, V = 0.0083 ...