Browsing Öksüz Yayınlar Koleksiyonu - Scopus by Author "Cadirli, E."
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Characterization of a Directionally Solidified Sn-Pb-Sb Ternary Eutectic Alloy
Cadirli, E.; Sahin, M.; Turgut, Y. (SPRINGER, 2015)A Sn-40.5wt%Pb-2.6wt%Sb ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified at a constant growth rate (V = 16.5 mu m/s) under different ... -
Characterization of rapidly solidified Ni-Si and Co-Al eutectic alloys in drop tube
Cadirli, E.; Herlach, D. M.; Volkmann, T. (ELSEVIER SCIENCE BV, 2010)Containerless solidifications of Ni-Si and Co-Al eutectic alloys were carried out using an 8 m drop tube. Molten alloy ejected into a drop tube was rapidly cooled and solidified during free fall. The microstructures of the ... -
Dendritic growth in an aluminum-silicon alloy
Kaya, H.; Cadirli, E.; Guenduez, M. (ASM INTERNATIONAL, 2007)Unidirectional solidification experiments have been carried out on an Al-3 wt.% Si alloy as a function of temperature gradient, G and growth rate, V. The samples were solidified under steady-state conditions with a constant ... -
Dendritic growth of the binary succinonitrile-camphor system
Cadirli, E.; Kaya, H. (WORLD SCIENTIFIC PUBL CO PTE LTD, 2007)Succinonitrile (SCN)-2wt% Camphor (CAMP) alloy was unidirectionally solidified with a constant temperature gradient (G=3.01 K/mm) at different growth rates (V=6.5- 113 mu m/s) and with a constant growth rate (V=6.5 mu m/s) ... -
Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy
Cadirli, E.; Sahin, M.; Kayali, R.; Ari, M.; Durmus, S. (SPRINGER, 2011)Sn-3.5 wt% Ag alloy was directionally solidified upward with a constant growth rate (V = 16.5 mu m/s) and a temperature gradient (G = 3.3 K/mm) in a Bridgman-type growth apparatus. The variations of electrical resistivity ... -
Dependence of Electrical Resistivity on Temperature and Sn Content in Pb-Sn Solders
Cadirli, E.; Boyuk, U.; Kaya, H.; Marasli, N.; Aksoz, S.; Ocak, Y. (SPRINGER, 2011)Pb(100-x)-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward with a constant growth rate (V = 37.4 mu m/s) in a temperature gradient (G = 4.8 ... -
The Dependence of Lamellar Spacings and Microhardness on the Growth Rate in the Directionally Solidified Bi-43 wt.% Sn Alloy at a Constant Temperature Gradient
Cadirli, E.; Kaya, H.; Marasli, N. (KOREAN INST METALS MATERIALS, 2009)Bi-43 wt.% Sn eutectic samples were directionally solidified upward with five different growth rates (V = 8.3-164.8 mu m/s) at a constant temperature gradient (G = 3.55 K/mm) in a Bridgman type directional solidification ... -
Dependency of Microstructural Parameters and Microindentation Hardness on the Temperature Gradient in the In-Bi-Sn Ternary Alloy with a Low Melting Point
Kaya, H.; Boyuk, U.; Cadirli, E.; Ocak, Y.; Akbulut, S.; Keslioglu, K.; Marasli, N. (KOREAN INST METALS MATERIALS, 2008)The ternary alloy In-21.5 at.% Bi-17.8 at.% Sn, which has a melting point of 60 degrees C, was directionally solidified upward with a constant growth rate (V = 3.2 mu m/s) and different temperature gradients (G = 0.91 K/mm ... -
Dependency of the thermal and electrical conductivity on the temperature and composition of Cu in the Al based Al-Cu alloys
Aksoz, S.; Ocak, Y.; Marasli, N.; Cadirli, E.; Kaya, H.; Boyuk, U. (ELSEVIER SCIENCE INC, 2010)The variations of thermal conductivity with temperature for Al-[x] wt.% Cu, x = 3, 6, 15 and 24 alloys were measured by using a radial heat flow apparatus. The variations of electrical conductivity of solid phases versus ... -
Determination of interfacial energies of solid Sn solution in the In-Bi-Sn ternary alloy
Akbulut, S.; Ocak, Y.; Marasli, N.; Keslioglu, K.; Kaya, H.; Cadirli, E. (ELSEVIER SCIENCE INC, 2009)The equilibrated grain boundary groove shapes of solid Sn solution (Sn-40.14 at.% In-16.11 at.% Bi) in equilibrium with the In-Bi-Sn liquid (In-21.23 at.% Bi-19.04 at.% Sn) were observed from the quenched sample at 59 ... -
Determination of solid-liquid interfacial energies in the In-Bi-Sn ternary alloy
Akbulut, S.; Ocak, Y.; Marasli, N.; Keslioglu, K.; Kaya, H.; Cadirli, E. (IOP PUBLISHING LTD, 2008)The equilibrated grain boundary groove shapes of solid In(2)Bi solution in equilibrium with the In-Bi-Sn eutectic liquid were observed from a quenched sample at 59 degrees C. The Gibbs-Thomson coefficient, solid-liquid ... -
Directional cellular growth of Al-2 wt% Li bulk samples
Kaya, H.; Cadirli, E.; Gunduz, M. (SPRINGER, 2009)Al-2 wt% Li alloy was prepared using metals of 99.99% high purity in the vacuum atmosphere. The bulk samples were directionally solidified upward with a constant growth rate, V, (similar to 8.30 mu m/s) and different ... -
Directional solidification and characterization of the Cd-Sn eutectic alloy
Cadirli, E.; Kaya, H.; Gunduz, M. (ELSEVIER SCIENCE SA, 2007)The Cd-67.8 wt.% Sn eutectic alloy was prepared by melting together appropriate amounts of cadmium and tin (both of 99.99% purity) in a graphite crucible in a vacuum melting furnace. Then, this eutectic alloy was poured ... -
Directional solidification of Al-Cu-Ag alloy
Boyuk, U.; Marasli, N.; Kaya, H.; Cadirli, E.; Keslioglu, K. (SPRINGER HEIDELBERG, 2009)Al-Cu-Ag alloy was prepared in a graphite crucible under a vacuum atmosphere. The samples were directionally solidified upwards under an argon atmosphere with different temperature gradients (G=3.99-8.79 K/mm), at a constant ... -
The effect of composition on microhardness and determination of electrical and thermal properties in the Sn-Cu alloys
Cadirli, E.; Kaya, H. (SPRINGER, 2011)Tin-copper of (99.99%) high purity alloys were directionally solidified upward with different compositions, C (o) , Sn-(1.2, 3, 6 and 15)wt% Cu under two different solidification conditions (temperature gradient (G) = 8 ... -
The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point
Cadirli, E.; Boyuk, U.; Kaya, H.; Marasli, N.; Keslioglu, K.; Akbulut, S.; Ocak, Y. (ELSEVIER SCIENCE SA, 2009)In-21.5 at.% Bi-17.8 at.% Sn ternary alloy which has 333 K melting point was directionally solidified upward with a constant temperature gradient (G = 0.91 K/mm) in a wide range of growth rates (3.2-157.1 mu m/s) with a ... -
Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder
Cadirli, E.; Boyuk, U.; Kaya, H.; Marasli, N. (KOREAN INST METALS MATERIALS, 2012)Sn-Bi-Zn lead free solder alloy was directionally solidified upward at a constant temperature gradient (G=3.99 K/mm) with a wide range of growth rates (8.3-478.6 mu m/s) and at a constant growth rate (V=8.3 mu m/s) with a ... -
Effect of solidification processing parameters on the cellular spacings in the Al-0.1 wt% Ti and Al-0.5 wt% Ti alloys
Gunduz, M.; Kaya, H.; Cadirli, E.; Marasli, N.; Keslioglu, K.; Saatci, B. (ELSEVIER SCIENCE SA, 2007)The aim of this work is to investigate the relationship between solidification processing parameters (temperature gradient, G, growth rate, V, and cooling rate T), and cellular spacing, lambda, in the Al-0.1 wt% Ti and ... -
Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100-x-Sn-x Solders
Cadirli, E.; Kaya, H.; Sahin, M. (SPRINGER, 2011)Pb100-x-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward over a wide range of cooling rates (T) over dot (0.016 K s(-1) to 4.0 K s(-1)) by ... -
Effects of growth rate and temperature gradient on the microstructure parameters in the directionally solidified succinonitrile-7.5 wt.% carbon tetrabromide alloy
Marasli, N.; Keslioglu, K.; Arslan, B.; Kaya, H.; Cadirli, E. (ELSEVIER SCIENCE SA, 2008)Succinonitrile (SCN)-7.5 wt.% carbon tetrabromide (CTB) alloy was unidirectionally solidified with a constant growth rate (V = 33 mu m/s) at five different temperature gradients (G = 4.1-7.6 K/mm) and with a constant ...